Successful soldering is largely dependent on the ability of the solder to wet and spread on component surfaces. A major barrier to wetting is presented by stable nonmetallic films and coatings on the surface, in particular oxides and carbonaceous residues. Oxide films on the faying surfaces present more than a physical barrier to wetting and spreading. Oxides are typically poor thermal conductors, compared to metals, and act as barrier to heat transfer, thereby exacerbating temperature gradients present and delaying fusion of the solder with the parent metal.The thermal contact resistance of electroplated and then reflowed