The 3DVIS is intended to be always

The 3DVIS is intended to be always running. Therefore, the processors on the control board require heat dissipation beyond what the display was originally designed for. A piece of thermal gap-filling putty will be placed over the processors and a few power supply inductors in order to thermally connect the electrical components to the rear cover. The cover requires a slight re-design to mate with the putty.

Please move the rear cover slits out of the way and provide an indentation in the rear cover over the putty pad so that the putty and rear cover come in contact with each other. An example of this putty and application can be found here: http://www.nucletron.de/en/thermal-and-energy-management/passive-thermal-mangement/gap-filler/.

In order to properly revise the cover, I have attached a Solidworks part file with dimensions of the chips and the intended putty pad overlaid onto a photo of the board. Please note that the dimensions in the Sketches are correct; the image is included as a visual aide and is not accurate. The height from the glass surface of the screen to the chips is 8mm and the height of the putty pad will be 3.2mm (1/8"). When installed, the rear cover should slightly interfere with the putty pad so it can squish and fill in the gaps.

Results (Russian) 1:

3DVIS предназначен для быть всегда работает. Таким образом процессоры на плате управления требует отвода тепла за то, что дисплей был первоначально разработан для. Кусок тепловой замазку пробелов будут размещены над процессоры и несколько дроссели питания мощности для термически подключения электрических компонентов к задней крышке. Обложке требует небольшой редизайн для сопряжения с замазкой.Просьба переместить прорезями заднюю крышку в сторону и предоставить отступ в заднюю крышку над шпаклевки pad, чтобы замазка и задняя крышка соприкасаться друг с другом. Пример этой замазкой и приложения можно найти здесь: http://www.nucletron.de/en/thermal-and-energy-management/passive-thermal-mangement/gap-filler/.Для того, чтобы должным образом пересмотреть крышку, я приложил файл часть Solidworks с размерами фишки и предполагаемой шпаклевки pad, накладывается на фото Совета. Пожалуйста, обратите внимание, что размеры в эскизы являются правильными; образ входит в качестве визуального помощником и не является точным. Высота от поверхности стекла экрана на фишки-8 мм и высота шпаклевки pad будет 3,2 мм (1/8"). При установке, заднюю крышку слегка должны вмешиваться с замазкой pad, поэтому можно хлюпать и заполнить пробелы.

Results (Russian) 2:

3DVIS The 3DVIS is intended to be always running. Therefore, the processors on the control board require heat dissipation beyond what the display was originally designed for. A piece of thermal gap-filling putty will be placed over the processors and a few power supply inductors in order to thermally connect the electrical components to the rear cover. The cover requires a slight re-design to mate with the putty.

Please move the rear cover slits out of the way and provide an indentation in the rear cover over the putty pad so that the putty and rear cover come in contact with each other. An example of this putty and application can be found here: http://www.nucletron.de/en/thermal-and-energy-management/passive-thermal-mangement/gap-filler/.

In order to properly revise the cover, I have attached a Solidworks part file with dimensions of the chips and the intended putty pad overlaid onto a photo of the board. Please note that the dimensions in the Sketches are correct; the image is included as a visual aide and is not accurate. The height from the glass surface of the screen to the chips is 8mm and the height of the putty pad will be 3.2mm (1/8"). When installed, the rear cover should slightly interfere with the putty pad so it can squish and fill in the gaps.